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HIOKI FA1813 FLYING PROBE TESTER

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Shop : Tools Bangladesh
Product ID : 4495
Brand : Hioki
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Upper arm board alignment uses a high-resolution camera with twice the pixels as the previous model and a high-magnification lens (with 2× optical zoom) to help achieve accurate probing of the fine-pitch pads found on high-density package boards.
“Probe-down with contact check,” a new function, facilitates optimal probe stroke to minimize impact marks, reducing damage to pads.

Key Features

  • Four-terminal measurement of fine-pitch pads
  • Reduced impact marking when used with the latest probes
  • Defect analysis using Process Analyzer

Key Features

  • Four-terminal measurement of fine-pitch pads
  • Reduced impact marking when used with the latest probes
  • Defect analysis using Process Analyzer

Specifications Overview

Number of arms 4 (2 each, top and bottom)
Mountable probes 1172 series, 1072 series, 1073 series
Number of test steps Max. 999,999 steps
Measurement parameters and measurement ranges  
  Resistance : 40.00 μΩ to 100.0 MΩ
  Constant DC current continuity
measurement		 400.0 m Ω to 1.000 k Ω
  Constant DC current resistance
value measurement		 40.00 μ Ω to 400.0 K Ω
  Constant DC voltage resistance
value measurement		 4.000 Ω to 40.00 M Ω
  Insulation resistance : 1.000 kΩ to 100.0 GΩ
  Capacitance : 100.0 fF to 10.00 μF
  Leak current measurement : 100.0 μA to 10.00 mA
  High voltage resistance : 1.000 kΩ to 100.0 GΩ
  Capacitance Insulation resistance : 1.000 kΩ to 10.00 MΩ
  Open test : 4.000 Ω to 4.000 MΩ
  Short test : 400.0 mΩ to 40.00 kΩ
  LSI Connection test 0.000 V to 12.00 V
  Measuring resistance 10.00 Ω to 100.0 k Ω
  Measuring capacitance
(For parts inspection)		 10.00 p F to 100.0 μ F
  Inductance : 1.000 μH to 1.000 mH
Judgment range -99.9% to +999.9% or absolute value
  Minimum resolution of XY movement 0.1 μm／pulse
  Minimum resolution of Z movement 1 μm／pulse
Minimum pad pitch Top surface: 32 um (with CP1075-09)
Bottom surface: 44 um (with CP1075-09)
Minimum pad size Top surface: 2 um (with CP1075-09)
Bottom surface: 14 um (with CP1075-09)
Measurement speed Max. 76 points/ s (X-Y movements of 0.15 mm, 4-arm simultaneous probing, when capacitance measurement)
Testable board size Thickness : 0.5 mm (0.02 in) to 2.5 mm (0.10 in)
Outer dimensions : 50 mm (1.97 in) W × 50 mm (1.97 in) D to 400 mm (15.75 in) W × 330 mm (12.99 in) D
Maximum testable area 398 mm (15.67 in) W × 304 mm (11.97 in) D
Board clamping Board 2-side chuck method (with tension function)
Power supply 200 V, 220 V, 230 V, 240 V AC single-phase (specify at time of order), 50/60 Hz, 5 kVA
Dimensions and mass 1355 mm (53.35 in) W × 1200 mm (47.25 in) H × 1265 mm (49.81 in) D, (Excluding protruding parts), 1,130 kg (39859.6 oz)

Upper arm board alignment uses a high-resolution camera with twice the pixels as the previous model and a high-magnification lens (with 2× optical zoom) to help achieve accurate probing of the fine-pitch pads found on high-density package boards.
“Probe-down with contact check,” a new function, facilitates optimal probe stroke to minimize impact marks, reducing damage to pads.

Key Features

  • Four-terminal measurement of fine-pitch pads
  • Reduced impact marking when used with the latest probes
  • Defect analysis using Process Analyzer

Key Features

  • Four-terminal measurement of fine-pitch pads
  • Reduced impact marking when used with the latest probes
  • Defect analysis using Process Analyzer

Specifications Overview

Number of arms 4 (2 each, top and bottom)
Mountable probes 1172 series, 1072 series, 1073 series
Number of test steps Max. 999,999 steps
Measurement parameters and measurement ranges  
  Resistance : 40.00 μΩ to 100.0 MΩ
  Constant DC current continuity
measurement		 400.0 m Ω to 1.000 k Ω
  Constant DC current resistance
value measurement		 40.00 μ Ω to 400.0 K Ω
  Constant DC voltage resistance
value measurement		 4.000 Ω to 40.00 M Ω
  Insulation resistance : 1.000 kΩ to 100.0 GΩ
  Capacitance : 100.0 fF to 10.00 μF
  Leak current measurement : 100.0 μA to 10.00 mA
  High voltage resistance : 1.000 kΩ to 100.0 GΩ
  Capacitance Insulation resistance : 1.000 kΩ to 10.00 MΩ
  Open test : 4.000 Ω to 4.000 MΩ
  Short test : 400.0 mΩ to 40.00 kΩ
  LSI Connection test 0.000 V to 12.00 V
  Measuring resistance 10.00 Ω to 100.0 k Ω
  Measuring capacitance
(For parts inspection)		 10.00 p F to 100.0 μ F
  Inductance : 1.000 μH to 1.000 mH
Judgment range -99.9% to +999.9% or absolute value
  Minimum resolution of XY movement 0.1 μm／pulse
  Minimum resolution of Z movement 1 μm／pulse
Minimum pad pitch Top surface: 32 um (with CP1075-09)
Bottom surface: 44 um (with CP1075-09)
Minimum pad size Top surface: 2 um (with CP1075-09)
Bottom surface: 14 um (with CP1075-09)
Measurement speed Max. 76 points/ s (X-Y movements of 0.15 mm, 4-arm simultaneous probing, when capacitance measurement)
Testable board size Thickness : 0.5 mm (0.02 in) to 2.5 mm (0.10 in)
Outer dimensions : 50 mm (1.97 in) W × 50 mm (1.97 in) D to 400 mm (15.75 in) W × 330 mm (12.99 in) D
Maximum testable area 398 mm (15.67 in) W × 304 mm (11.97 in) D
Board clamping Board 2-side chuck method (with tension function)
Power supply 200 V, 220 V, 230 V, 240 V AC single-phase (specify at time of order), 50/60 Hz, 5 kVA
Dimensions and mass 1355 mm (53.35 in) W × 1200 mm (47.25 in) H × 1265 mm (49.81 in) D, (Excluding protruding parts), 1,130 kg (39859.6 oz)

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